General Specification
| Item | Specification | unit |
| Dimension outline | 38.6 x 40.5 x 0.67 | mm |
| LTPS Glass outline | 38.6 x 40.5 | mm |
| Encapsulation Glass outline | φ38.6 | mm |
| Number of dots | 400(W) x RGB x 400(H) | dots |
| Active area | φ35.4 | mm |
| Diagonal size | 1.39 | inch |
| Pixel pitch | 29.5 x 88.5 | μm |
| Glass thickness (LTPS/encapsulation glass) | 0.2 / 0.2 | mm |
| Weight | 2 | g |
Interface Definition
| # | Pin_name | I/O | Description |
| 1 | ELVSS1 | Power | AMOLED power Negative |
| 2 | ELVDD1 | Power | AMOLED power Positive |
| 3 | ELVSS2 | Power | AMOLED power Negative |
| 4 | ELVDD2 | Power | AMOLED power Positive |
| 5 | ELVSS3 | Power | AMOLED power Negative |
| 6 | ELVDD3 | Power | AMOLED power Positive |
| 7 | VCI | Power | Driver IC analog supply |
| 8 | GND2 | Power | The power ground |
| 9 | VDDIO | Power | Driver IC digital I/O supply |
| 10 | DSI_D0N | I/O | MIPI DSI data0- |
| 11 | GND1 | Power | The power ground |
| 12 | DSI_D0P | I/O | MIPI DSI data0+ |
| 13 | TE | O | Tear effect output |
| 14 | GND3 | Power | The power ground |
| 15 | VPP | Power | Power supply for OTP. Leave the pin to open when not in use. |
| 16 | DSI_CLKN | I/O | MIPI DSI clock- |
| 17 | REST | I | This signal will reset the device and must be applied to properly initialize the chip. Active low. |
| 18 | DSI_CLKP | I/O | MIPI DSI clock+ |
| 19 | SWIRE | O | Swire protocol setting pin of Power IC |
| 20 | GND4 | Power | The power ground |
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